Back Wafer Processing Wheel

A precision processing diamond tool to grind back wafer, an unnecessary part after FAB process, in order to maintain a consistent wafer thickness and produce excellent surface profile

CMP PAD CONDITIONER

Continuously conditioning front pad to polish wafer and evenly distribute slurry on the front pad

PCD Pin

A PDP glass cutter with a diamond shaft which supports the cutting wheel to back up rolling motion

Glass Cutting Wheel

A PDP glass cutter with a diamond cutting wheel that can cut PDP glass to the desired size

TFT-LCD Chamfer Wheel

A PDP glass cutter with diamond cutting wheel which can cut PDP glass to the desired size